Fibocom 5G LPWA module MS180 is based on Sony Altair 1350. Designed to provide ultra-low power consumption and reliable wireless connectivity.
Fibocom Wireless Inc., a renowned global provider of IoT (Internet of Things) wireless solutions and wireless communication modules, has announced an exciting collaboration with Sony Semiconductor Israel (Sony), a leading provider of Cellular IoT chipsets, to launch the groundbreaking 5G LPWA MS180 module MS18 series. Officially unveiled at Embedded World 2023 in Nuremberg, Germany, the Fibocom MS18 module series is powered by Sony's cutting-edge Altair ALT1350 chipset, which is designed to deliver ultra-low power consumption and reliable wireless connectivity for the rapidly growing 5G massive IoT market. This strategic partnership between Fibocom and Sony combines their expertise in LPWA 5G technology and the Altair 1350 chipset to create a game-changing solution that will revolutionize the IoT landscape.
The Fibocom MS18 series, powered by Sony's best-in-class Altair ALT1350 chipset, is a SOC integrated LPWA module that offers a comprehensive set of features and capabilities tailored to the demands of 5G massive IoT applications. With optimized power consumption as a key focus, the MS18 series boasts an AI engine for edge processing, support for the latest 3GPP Release 14 through 17 of LTE-M/NB-IoT, unlicensed spectrum communications protocols, Non-Terrestrial Network (NTN) satellite communications, Wi-Fi SSID-based location, and short-range radio. By leveraging the power of LPWA 5G technology and the advanced capabilities of the Altair 1350 chipset, the MS18 series enables seamless connectivity, enhanced performance, and extended battery life for a wide range of IoT devices and applications.
One of the standout features of the Fibocom MS18 series is its compact footprint, measuring less than 200 square millimeters. This ultra-compact size, combined with the LGA form factor and optimized low power consumption, makes the MS18 series an ideal choice for 5G Massive Machine Type Communication (MTC) applications such as smart metering, asset tracking, and connected health. By harnessing the power of LPWA 5G technology and the energy-efficient design of the Altair 1350 chipset, the MS18 series offers an unprecedented battery life of up to 15-20 years, eliminating the need for frequent battery replacements and reducing maintenance costs. This compact and power-efficient design enables IoT device manufacturers to develop smaller, more streamlined products without compromising on performance or connectivity.
The Fibocom MS18 series, powered by Sony's Altair 1350 chipset, is designed to cater to a wide range of IoT applications across various industries. From smart metering and asset tracking to telematics, telehealth, smart cities, and consumer electronics, the MS18 series provides a flexible and reliable solution for LPWA 5G connectivity. The module's support for multiple communication protocols, including LTE-M/NB-IoT, unlicensed spectrum, and satellite communications, ensures seamless integration with existing networks and enables IoT devices to operate in diverse environments. With its open CPU, iSIM, hardware-based application security, and FOTA (Firmware Over-the-Air) capabilities, the MS18 series offers a rapid and flexible integration experience for customers looking to launch their devices in LPWA applications. By leveraging the power of LPWA 5G and the advanced features of the Altair 1350 chipset, Fibocom empowers businesses to develop innovative IoT solutions that drive efficiency, automation, and intelligence across various sectors.
The collaboration between Fibocom and Sony brings together two industry leaders with a shared vision of advancing LPWA 5G technology and unleashing its potential for the IoT ecosystem. Fibocom, with its 23+ years of expertise in the cellular module industry, and Sony, with its cutting-edge Altair 1350 chipset, have joined forces to create a powerful solution that addresses the evolving needs of the 5G massive IoT market. By combining their strengths and know-how, Fibocom and Sony are poised to drive innovation, accelerate the adoption of LPWA 5G, and enable businesses to unlock new opportunities in the IoT landscape. The MS18 series, born out of this strategic partnership, represents a significant milestone in the advancement of LPWA 5G technology and sets a new standard for performance, power efficiency, and connectivity in the IoT industry.
As the IoT market continues to evolve and expand, the demand for reliable, low-power, and cost-effective connectivity solutions has never been greater. Fibocom, in collaboration with Sony, is at the forefront of addressing this demand with the launch of the MS18 series, powered by the Altair 1350 chipset. By leveraging the power of LPWA 5G technology and the advanced capabilities of the Altair 1350, the MS18 series offers a game-changing solution that enables businesses to develop innovative IoT applications with enhanced performance, extended battery life, and seamless connectivity. With engineering samples of the MS18 series set to be available in Q3 2023, Fibocom and Sony are poised to shape the future of LPWA 5G and drive the adoption of IoT across various industries. As businesses increasingly recognize the transformative potential of LPWA 5G, the MS18 series, powered by the Altair 1350 chipset, will play a crucial role in enabling them to unlock new opportunities, drive efficiency, and create value in the connected world.
Nuremberg, Germany – March 13th, 2023 –Fibocom Wireless Inc., a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the cooperation with Sony Semiconductor Israel (Sony), a leading provider of Cellular IoT chipsets, in launching the 5G LPWA MS180 module MS18 series which will be announced officially at Embedded World 2023. Powered by Sony’s Altair, best in class ALT1350 chipset, the Fibocom MS18 module series is designed to provide ultra-low power consumption and reliable wireless connectivity for the 5G massive IoT market.
With optimized power consumption, Fibocom MS18 series is a SOC integrated LPWA module with an AI engine for edge processing, supports the latest 3GPP Release 14 through 17 of LTE-M/NB-IoT, unlicensed spectrum communications protocols, Non-Terrestrial Network (NTN) satellite communications, Wi-Fi SSID-based location, and Short-range radio. MS18 series will also adopt a compact footprint of less than 200 sq millimetersto be best utilized in the 5G Massive Machine Type Communication (MTC) applications such as smart metering, asset tracking and connected health. It is worth mentioning that the MS18 series adopts LGA form factor, with ultra-compact size and optimized low power consumption, offering unprecedented battery life up to 15-20 years.
Jason Zhu, General Manager of MTC BU,Fibocom: "By collaborating with Sony and combining Fibocom's 23+ years of know-how in the cellular module industry, we are excited to bring to the marketan ultimate LPWA module with excellent performance yet best in class power consumption, compact size, broad communications protocol with vast integrated features such as Open CPU, iSIM, hardware based application security, and FOTA.MS18 series provides a rapid and flexible integration experience for our customers launch their devices in LPWA applications, such as smart metering, tracking, telematics, telehealth, smart city, consumer electronics. Fibocom is very honored to be a partner of Sony, to bring our new MS18 series, powered by ALT1350 to the 5G IoT Ecosystem.”
Engineering sample of MS18 series will be available in Q3 2023. Welcome to visit Fibocom Booth 3-222 at Embedded World 2023, Nuremberg Germany, to learn more about Fibocom module portfolio and solutions.
