Fiboocm FG360-MEA modules, tailored for the Middle Eastern and African market. It supports both 5G standalone (SA) and non-standalone (NSA) network architectures, delivering enhanced transmission speed, greater carrying capacity, and reduced network latency.
The module features the MTK T750 chip, with a 7nm process. Its compact LGA packaging measures 41 x 44 x 2.75mm. It seamlessly incorporates 5G NR Sub-6GHz dual-carrier aggregation (2CC CA) over 200MHz, providing an exceptional 5G broadband experience: up to 4.67Gbps downstream and 1.25Gbps upstream. This version offers 6 and 8 antenna configurations for various customer needs. Utilizing a PCIe 3.0 connects with WiFi chips, supporting various configurations like AX1800/AX3600, thus expanding high-speed wireless network coverage for devices.
The high-speed FG360-MEA 5G module enhances wireless 5G experiences for homes, businesses, and mobile users. It seamlessly integrates with Fixed Wireless Access (FWA) elements like CPE, ODU, gateways, routers, as well as industrial and medical terminals.