Fibocom FM160-EAU is a NR Sub 6 module with 3GPP Release 16, which is backward compatible with LTE/WCDMA network standards. Powered by the Qualcomm Snapdragon® X62 modem chipset, the module delivers maximum downlink rates of 3.5Gbps and uplink rates of 900Mbps under 5G, suitable for IoT applications that require high data throughput.
Fibocom FM160-EAU module adopts M.2 form factor measuring 30x52x2.3mm. It is compatible with Fibocom’s 5G module FM150. The module also supports multi-constellation GNSS receiver (GPS/ Galileo/ GLONASS/ BeiDou), which provides high-performance positioning and navigation while greatly simplifies product design. Meanwhile, it supports a rich set of interfaces including USIM, USB 3.1/3.0, PCIe 4.0 and PCM/I2S, allowing much flexibility and ease of integration for customer's application.
With multiple Internet protocols and industry-standard interfaces for main operating, FM160-EAU can be used a variety of cellular terminals such as CPE, STB, IPC and ODU. The module is able to cover mobile network in Latin America and Europe.
Find out how Qualcomm SDX62-integrated 5G module FM160 is bridging the digital divide with incomparable speed of up to 3.5Gbps DL and 900Mbps UL.
Fibocom, a global leader in wireless communication modules and solutions, is proud to introduce the FM160-EAU, a cutting-edge 5G Sub-6 GHz module powered by the Qualcomm Snapdragon® X62 modem chipset. Designed to bridge the digital divide and empower IoT applications with unprecedented speeds of up to 3.5Gbps downlink and 900Mbps uplink, the FM160-EAU module is a testament to Fibocom's commitment to innovation and its partnership with Qualcomm Technologies, Inc.
At the heart of Fibocom's FM160-EAU module lies the Qualcomm Snapdragon® X62 modem chipset, a true powerhouse of 5G technology. The SDX62 chipset enables the module to deliver maximum downlink rates of 3.5Gbps and uplink rates of 900Mbps under 5G, making it an ideal choice for IoT applications that demand high data throughput and low latency. With support for 3GPP Release 16 and backward compatibility with LTE/WCDMA network standards, the FM160-EAU module, powered by the Qualcomm SDX62, ensures seamless connectivity and future-proofing for businesses investing in 5G IoT solutions.
Fibocom's FM160-EAU module, powered by the Qualcomm SDX62 chipset, boasts a compact M.2 form factor measuring just 30x52x2.3mm, making it compatible with Fibocom's existing 5G module FM150. This compatibility allows for easy upgrades and seamless integration into a wide range of devices. Despite its compact size, the FM160-EAU module offers a rich set of interfaces, including USIM, USB 3.1/3.0, PCIe 4.0, and PCM/I2S, providing flexibility and ease of integration for customers' applications. Additionally, the module supports multi-constellation GNSS receiver (GPS/Galileo/GLONASS/BeiDou), enabling high-performance positioning and navigation while simplifying product design. With the Qualcomm SDX62 at its core, the FM160-EAU module delivers unparalleled performance and functionality in a compact package.
The Fibocom FM160-EAU module, powered by the Qualcomm SDX62 chipset, is designed to empower a wide range of IoT applications that require high-speed, reliable, and low-latency connectivity. From Customer Premises Equipment (CPE) and Set-Top Boxes (STB) to Industrial PCs (IPC) and Outdoor Units (ODU), the FM160-EAU module provides a versatile solution for various cellular terminals. With support for multiple Internet protocols and industry-standard interfaces for main operating systems, including Windows, Linux, and Android, the module ensures compatibility and ease of integration across different platforms. The Qualcomm SDX62 chipset enables the FM160-EAU to deliver exceptional performance, making it suitable for applications such as high-definition video streaming, real-time data analytics, remote monitoring, and control in industries ranging from manufacturing and transportation to healthcare and smart cities.
Fibocom's FM160-EAU module, powered by the Qualcomm SDX62 chipset, is designed to provide global connectivity, covering mobile networks in Latin America and Europe. The module supports a wide range of frequency bands, including Sub-6 GHz bands (n1/3/5/7/8/20/28/38/40/41/75/76/77/78), LTE FDD bands (B1/3/5/7/8/20/28/32), LTE TDD bands (B38/40/41/42/43), and WCDMA bands (B1/5/8). This comprehensive coverage ensures that devices equipped with the FM160-EAU module can operate seamlessly across different regions and network standards. Moreover, the module has obtained CE and RCM certifications, demonstrating its compliance with stringent regulatory requirements. With the power of the Qualcomm SDX62 chipset and Fibocom's expertise in wireless communication, the FM160-EAU module offers global connectivity and reliability for IoT deployments worldwide.
The collaboration between Fibocom and Qualcomm Technologies, Inc. exemplifies the commitment of both companies to drive 5G innovation and empower the IoT ecosystem. By leveraging the advanced capabilities of the Qualcomm Snapdragon® X62 modem chipset, Fibocom's FM160-EAU module delivers unparalleled performance, efficiency, and reliability. The Qualcomm SDX62 chipset, known for its cutting-edge 5G technology, enables the module to support advanced features such as 4x4 MIMO, carrier aggregation, and dual connectivity, ensuring optimal network performance and user experience. Through this partnership, Fibocom and Qualcomm aim to accelerate the adoption of 5G in the IoT landscape, enabling businesses to unlock new opportunities, drive digital transformation, and create innovative solutions that shape the future of connected industries.
A: The qualcomm sdx62 chipset is a cutting-edge 5G modem chipset that powers the Fibocom FM160-EAU module. This chipset is the backbone of the module's high-speed connectivity, enabling it to deliver maximum downlink rates of 3.5Gbps and uplink rates of 900Mbps under 5G. The qualcomm sdx62 chipset's advanced capabilities make it suitable for IoT applications that require high data throughput.
A: The qualcomm sdx62 chipset ensures that the FM160-EAU module is backward compatible with LTE/WCDMA network standards. This feature allows the module to operate on a wide range of network infrastructures, providing seamless connectivity and ensuring that the module remains relevant as network standards evolve.
A: Yes, the qualcomm sdx62 chipset supports multi-constellation GNSS receiver (GPS/Galileo/GLONASS/BeiDou) within the FM160-EAU module. This support provides high-performance positioning and navigation capabilities, which greatly simplifies product design and enhances the module's functionality.
A: The qualcomm sdx62 chipset enables a rich set of interfaces in the FM160-EAU module, including USIM, USB 3.1/3.0, PCIe 4.0, and PCM/I2S. These interfaces allow for much flexibility and ease of integration for customers' applications, ensuring that the module can be seamlessly incorporated into a variety of devices.
A: The qualcomm sdx62 chipset supports a wide range of frequency bands, ensuring that the FM160-EAU module can provide global connectivity across different regions and network standards. This comprehensive coverage allows devices equipped with the FM160-EAU module to operate seamlessly in markets around the world.
A: The qualcomm sdx62 chipset has contributed to the FM160-EAU module obtaining CE and RCM certifications. These certifications demonstrate the module's compliance with stringent regulatory requirements, ensuring its reliability and global deployability.
A: The qualcomm sdx62 chipset's 4x4 MIMO support allows the FM160-EAU module to transmit and receive multiple data signals simultaneously, significantly increasing data throughput and enhancing overall performance. This feature is particularly beneficial for IoT applications that demand high-speed and low-latency connectivity.
A: The qualcomm sdx62 chipset enables carrier aggregation in the FM160-EAU module, allowing it to combine multiple radio frequency bands to create a larger bandwidth. This capability results in increased data speeds and enhanced network capacity, providing a superior user experience.
A: The qualcomm sdx62 chipset's support for 3GPP Release 16 ensures that the FM160-EAU module is aligned with the latest 5G standards. This alignment provides future-proof connectivity and advanced features for IoT applications, ensuring that the module remains at the forefront of technological advancements.
A: The dual connectivity feature supported by the qualcomm sdx62 chipset allows the FM160-EAU module to use multiple radio interfaces simultaneously. This capability improves network performance and user experience by providing more reliable and robust connectivity.
A: The qualcomm sdx62 chipset, through the FM160-EAU module, provides high-speed, reliable, and low-latency connectivity. This connectivity is essential for various IoT applications, such as high-definition video streaming, real-time data analytics, remote monitoring, and control in industries ranging from manufacturing and transportation to healthcare and smart cities.
A: The qualcomm sdx62 chipset is a testament to Fibocom's commitment to innovation. By integrating this advanced chipset into the FM160-EAU module, Fibocom is able to deliver unparalleled performance, efficiency, and reliability, driving the adoption of 5G in the IoT landscape.
A: The compact design enabled by the qualcomm sdx62 chipset allows the FM160-EAU module to be easily integrated into a wide range of devices. This compact form factor, measuring just 30x52x2.3mm, offers flexibility and ease of integration for customers' applications.
A: The qualcomm sdx62 chipset provides features such as high-speed connectivity, multi-constellation GNSS, and a rich set of interfaces, making the FM160-EAU module suitable for outdoor units that require robust and reliable connectivity.
A: The qualcomm sdx62 chipset supports a comprehensive range of frequency bands, enabling the FM160-EAU module to operate seamlessly across different regions and network standards. This ensures global connectivity and reliability for IoT deployments.
A: The qualcomm sdx62 chipset enhances the FM160-EAU module's performance in smart city applications by providing high-speed connectivity, low latency, and advanced features such as carrier aggregation and MIMO. These capabilities are crucial for managing various smart city services effectively.
A: The integration of the qualcomm sdx62 chipset in the FM160-EAU module contributes to the digital transformation of industries by enabling high-speed, reliable, and low-latency connectivity. This connectivity is essential for the deployment of IoT solutions and advanced digital services that drive innovation and efficiency.
A: The support for multiple Internet protocols by the qualcomm sdx62 chipset allows the FM160-EAU module to be compatible with various cellular terminals and operating systems. This compatibility ensures ease of integration and flexibility in different application scenarios.
A: The qualcomm sdx62 chipset ensures compatibility with main operating systems such as Windows, Linux, and Android. This compatibility provides a versatile solution for various platforms and enhances the FM160-EAU module's usability across different devices.
A: The qualcomm sdx62 chipset plays a pivotal role in accelerating the adoption of 5G in the IoT landscape. By providing advanced 5G technology and performance in the FM160-EAU module, it enables businesses to unlock new opportunities, drive digital transformation, and create innovative solutions that shape the future of connected industries.
Package | M.2 |
Dimension (mm) | 30x52x2.3 |
Sub-6 | n1/3/5/7/8/20/28/38/40/41/75/76/77/78 |
mmWave | NA |
LTE FDD | B1/3/5/7/8/20/28/32 |
LTE TDD | B38/40/41/42/43 |
WCDMA | B1/5/8 |
Operation mode | NSA&SA |
Antenna | 4 |
Operating Voltage | 3.135V~4.4V, Typical 3.8V |
Operating Temp. | -30°C - +75°C |
NR MIMO |
DL 4*4MIMO: n1/3/5/7/20/28/38/40/41/75/76/77/78 UL 2*2MIMO: n41/77/78 |
LTE MIMO |
DL 4*4 MIMO: B1/3/5/7/20/28/32/38/40/41/42/43 |
NR SA(Mbps) | 2470(DL) / 900(UL) |
NR ENDC(Mbps) | 3470(DL) / 555(UL) |
LTE(Mbps) | 1600(DL) / 211(UL) |
WCDMA(Mbps) | 42(DL) / 5.76(UL) |
Voice | VoLTE & VoNR |
SMS | SMS over IP(IMS) |
Audio | ● |
FOTA | ● |
OS Drivers | Windows/Linux/Android |
GNSS | GPS/GLONASS/Galileo/BeiDou/QZSS |
USB | USB3.1/3.0 & USB2.0 |
PCle | PCle4.0 |
UART | NA |
SPI | NA |
GPIO | ● |
I2C | NA |
SDIO | NA |
UIM | ● |
I2S | ● |
MIPI | ● |
RGMII | NA |
Regulation | CE/RCM |
Operator | NA |
Industry | GCF |